CYBERSOLV® C8882
Understencil Wipe / Stencil Cleaning
Thank you for requesting the CYBERSOLV C8882 Product Bulletin. C8882 is a fast-acting stencil cleaning solvent designed for the understencil wipe process. CYBERSOLV C8882 instantly dissolves all flux types within the solder paste, including water-soluble, rosin and low residue no-clean fluxes.
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